IBM has released a pair of quantum chips — Nighthawk and Loon — that the company hopes will give it a credible shot at demonstrating the quantum advantage over regular processors. The designs split into two directions, with the Loon chip being the more experimental of the pair.

Nighthawk is IBM’s main bet. The chip is a 120-qubit version that’s due for distribution to partners in late 2025, using 218 tunable couplers in a square lattice to tighten control over qubit interactions. IBM says the layout will let it “execute circuits with 30 percent more complexity” and run problems that require up to 5,000 two-qubit gates. The company wants this line to mature quickly enough to power its first verifiable advantage claim.

Loon goes off the conventional path. Instead of keeping qubits on a flat plane, it links them vertically as well. New Scientist has flagged the design as an early test of 3D quantum layouts — an attempt to reduce errors by giving qubits more routes to talk to each other. It’s not aimed at near-term rollout but could shape future rigs if the approach holds.

The split strategy underlines IBM’s view that smart connectivity, not headline qubit counts, will decide who reaches the next milestone. Google, on the other hand, is leaning another way: Its Willow chip, paired with the “Quantum Echoes” algorithm, has already been presented as a proof point for “the first-ever verifiable quantum advantage running the out-of-order time correlator (OTOC) algorithm”.

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IBM is also backing a community-run quantum advantage tracker with Algorithmiq, the Flatiron Institute and BlueQubit. The framework “supports three experiments for quantum advantage across observable estimation, variational problems, and problems with efficient classical verification,” and IBM is pushing researchers to contribute.

For MENA labs building quantum and HPC programs under national digitalization efforts, the contrast between Nighthawk and Loon offers a clearer view of where the hardware race may bend next — tight, lattice-driven control on one side; a stab at 3D connectivity on the other.

The field is moving fast, and IBM’s twin quantum chips mark its next swing at staying in the fight.